Sony Xperia Z5 was one of the few Smartphones that pack in heat pipe for cooling. The primary logic behind it was excessive heating Snapdragon 810 SoC. Motorola seems to consolidate the similar science in its upcoming fourth gen Moto X handsets to avert smartphones from excessive heating.
The thought-provoking factor is that the device is being speculated to sport Snapdragon 820 SoC , which apparently means that Qualcomm is still struggling with the heat issues. The other side can be that Motorola is including this feature just to be on the safer side. The leaked picture also advocates that the internal build of the body will be constituted from metal and it is in alignment with the formerly leaked picture.
In addition, the slots for front and back cameras are also visible, however that’s all one can actually extract out of these leaked images.
The incorporation of a heat pipe to combat the overheating issues was also employed by Microsoft for their Lumia 950 XL Smartphone flagship.
Certainly it is too early to speculate about features and specs. However the Moto X (Next-Gen) is expected to flaunt a Snapdragon 820 chipset from Qualcomm and is also expected to offer at least 3GB of RAM.
It is also noteworthy to mention that the image might have been taken from any precursor, so things can definitely get changed in the ensuing few months.
For now the strategy seems an intelligent move to counter the overheating issue and to ensure a smooth Smartphone experience for Motorola users.
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